according to reply from BSFrance support for 1.3. version : No solder pad need to be soldered for using the board, DIO1 is closed by default if you need to use LMIC, also compared to V1.2 and except for the sensors options that are not mounted on your particular board the difference is that the LiPo charger and the voltage divider for battery monitoring are controlled by a MOS from PB0 (active low).