Was aware of that.
However mintenj mentioned:
Which the RAK3172 cannot because they don’t provide LP PA on the module.
For BOM and PCB size this may be smart but if this means using 45.5 mA instead of 23.5 mA that would be possible if it would have supplied LP PA (RFO_LP or whatever its exact name) that means it uses twice as much power (45.5 mA) than what would have been possible with the STM32WLE55 chip. From battery operation perspective that would be a design flaw because using some 100% more power than necessary (if I understand correctly).